Before they are released for production, chips undergo an extensive testing procedure to ensure that they meet the standards of the industry. Various types of tests are performed to check the performance and functionality of chips, including wafer probing, burn-in testing, and final testing.

Wafer probing is the first step in chip testing, where tiny probes are used to test each individual chip at the wafer level. Burn-in testing is a process where the chips go through extreme heating and cooling cycles to ensure that they remain stable in different environmental conditions. The final testing stage involves testing the chips in the actual device, where they are tested for their performance and accuracy.

The testing process can be complex and time-consuming, requiring specialized equipment and skilled personnel. However, thorough testing is crucial to ensure the quality and reliability of the chips. Faulty chips can lead to device malfunctions, which can have serious consequences.